HLMP-2785 - Agilent / Hewlett-Packard

LED Light Bars

Technical Data

Features

• Large Bright, Uniform Light

Emitting Areas

• Choice of Colors

• Categorized for Light Output

• Yellow and Green

Categorized for Dominant

Wavelength

• Excellent ON-OFF Contrast

• X-Y Stackable

• Flush Mountable

• Can be Used with Panel and

Legend Mounts

• Light Emitting Surface

Suitable for Legend

Attachment per Application

Note 1012

• HLCP-X100 Series Designed

for Low Current Operation

• Bicolor Devices Available

Applications

• Business Machine

Message Annunciators

• Telecommunications

Indicators

• Front Panel Process Status

Indicators

• PC Board Identifiers

• Bar Graphs

Description

The HLCP-X100 and HLMP-2XXX

series light bars are rectangular

light sources designed for a

variety of applications where a

large bright source of light is

required. These light bars are

configured in single-in-line and

dual-in-line packages that contain

either single or segmented light

emitting areas. The AlGaAs Red

HLCP-X100 series LEDs use

double heterojunction AlGaAs on

a GaAs substrate. The HER

HLMP-2300/2600 and Yellow

HLMP-2400/2700 series LEDs

have their p-n junctions diffused

into a GaAsP epitaxial layer on a

GaP substrate. The Green HLMP-

2500/2800 series LEDs use a

liquid phase GaP epitaxial layer

on a GaP substrate. The bicolor

HLMP-2900 series use a

combination of HER/Yellow or

HER/Green LEDs.

HLCP-A100, -B100, -C100,

-D100, -E100, -F100, -G100,

-H100

HLMP-2300, -2350, -2400,

-2450, -2500, -2550, -2600,

-2620, -2635, -2655, -2670,

-2685, -2700, -2720, -2735,

-2755, -2770, -2785, -2800,

-2820, -2835, -2855, -2870,

-2885, -2950, -2965

Selection Guide

Light Bar Part Number Corresponding

Size of Package Panel and

HLCP- HLMP- Light Emitting Areas Outline Legend Mount

Part No. HLMP-

AlGaAs HER Yellow Green

A100 2300 2400 2500 8.89 mm x 3.81 mm 1 A 2599

(.350 in. x .150 in.)

B100 2350 2450 2550 19.05 mm x 3.81 mm 1 B 2598

(.750 in. x .150 in.)

D100 2600 2700 2800 8.89 mm x 3.81 mm 2 D 2898

(.350 in. x .150 in.)

E100 2620 2720 2820 8.89 mm x 3.81 mm 4 E 2899

(.350 in. x .150 in.)

F100 2635 2735 2835 3.81 mm x 19.05 mm 2 F 2899

(.150 in. x .750 in.)

C100 2655 2755 2855 8.89 mm x 8.89 mm 1 C 2898

(.350 in. x .350 in.)

G100 2670 2770 2870 8.89 mm x 8.89 mm 2 G 2899

(.350 in. x .350 in.)

H100 2685 2785 2885 8.89 mm x 19.05 mm 1 H 2899

(.350 in. x .750 in.)

2950 2950 8.89 mm x 8.89 mm Bicolor I 2898

(.350 in. x .350 in.)

2965 2965 8.89 mm x 8.89 mm Bicolor I 2898

(.350 in. x .350 in.)

Number

Light

Emitting

Areas

Package Dimensions

NOTES:

1. DIMENSIONS IN MILLIMETRES (INCHES). TOLERANCES ±0.25 mm (±0.010 IN.) UNLESS OTHERWISE INDICATED.

2. FOR YELLOW AND GREEN DEVICES ONLY.

Internal Circuit Diagrams

Absolute Maximum Ratings

HER Yellow Green

AlGaAs Red HLMP-2300/ HLMP-2400/ HLMP-2500/

Parameter HLCP-X100 2600/29XX 2700/2950 2800/2965

Series Series Series Series

Average Power Dissipated per LED Chip 37 mW[1] 135 mW[2] 85 mW[3] 135 mW[2]

Peak Forward Current per LED Chip 45 mA[4] 90 mA[5] 60 mA[5] 90 mA[5]

Average Forward Current per LED Chip 15 mA 25 mA 20 mA 25 mA

DC Forward Current per LED Chip 15 mA[1] 30 mA[2] 25 mA[3] 30 mA[2]

Reverse Voltage per LED Chip 5 V 6 V[6]

Operating Temperature Range –20°C to +100°C[7] –40°C to +85°C –20°C to +85°C

Storage Temperature Range –40°C to +85°C

Lead Soldering Temperature 1.6 mm 260°C for 3 seconds[8]

(1/16 inch) Below Seating Plane3

Notes:

1. Derate above 87°C at 1.7 mW/°C per LED chip. For DC operation, derate above 91°C at 0.8 mA/°C.

2. Derate above 25°C at 1.8 mW/°C per LED chip. For DC operation, derate above 50°C at 0.5 mA/°C.

3. Derate above 50°C at 1.8 mW/°C per LED chip. For DC operation, derate above 60°C at 0.5 mA/°C.

4. See Figure 1 to establish pulsed operation. Maximum pulse width is 1.5 mS.

5. See Figure 6 to establish pulsed operation. Maximum pulse width is 2 mS.

6. Does not apply to bicolor parts.

7. For operation below –20°C, contact your local Agilent sales representative.

8. Maximum tolerable component side temperature is 134°C during solder process.

Electrical/Optical Characteristics at TA = 25°C

AlGaAs Red HLCP-X100 Series

Parameter HLCP- Symbol Min. Typ. Max. Units Test Conditions

A100/D100/E100 IV3 7.5 mcd IF = 3 mA

Luminous Intensity

per Lighting Emitting B100/C100/F100/G100 6 15 mcd

Area[1]

H100 12 30 mcd

Peak Wavelength λPEAK 645 nm

Dominant Wavelength[2] λd637 nm

Forward Voltage per LED VF1.8 2.2 V IF = 20 mA

Reverse Breakdown Voltage per LED VR515 V I

= 100 µA

Thermal Resistance LED Junction-to-Pin RθJ-PIN 250 °C/W/

LED

Parameter HLMP- Symbol Min. Typ. Max. Units Test Conditions

2400/2700/2720 IV6 20 mcd IF = 20 mA

Luminous Intensity

per Lighting Emitting 2450/2735/2755/2770/2950[3] 13 38 mcd

Area[1]

2785 26 70 mcd

Peak Wavelength λPEAK 583 nm

Dominant Wavelength[2] λd585 nm

Forward Voltage per LED VF2.1 2.6 V IF = 20 mA

Reverse Breakdown Voltage per LED[5] VR615 V I

= 100 µA

Thermal Resistance LED Junction-to-Pin RθJ-PIN 150 °C/W/

LED

High Efficiency Red HLMP-2300/2600/2900 Series

Parameter HLMP- Symbol Min. Typ. Max. Units Test Conditions

2300/2600/2620 IV6 23 mcd IF = 20 mA

Luminous Intensity

per Lighting Emitting 2350/2635/2655/2670/2950[3] 13 45 mcd

Area[1]

2965[4] 19 45 mcd

2685 22 80 mcd

Peak Wavelength λPEAK 635 nm

Dominant Wavelength[2] λd626 nm

Forward Voltage per LED VF2.0 2.6 V IF = 20 mA

Reverse Breakdown Voltage per LED[5] VR615 V I

= 100 µA

Thermal Resistance LED Junction-to-Pin RθJ-PIN 150 °C/W/

LED

Yellow HLMP-2400/2700/2950 Series

High Performance Green HLMP-2500/2800/2965 Series

Parameter HLMP- Symbol Min. Typ. Max. Units Test Conditions

2500/2800/2820 IV5 25 mcd IF = 20 mA

Luminous Intensity

per Lighting Emitting 2550/2835/2855/2870 11 50 mcd

Area[1]

2965[4] 25 50 mcd

2885 22 100 mcd

Peak Wavelength λPEAK 565 nm

Dominant Wavelength[2] λd572 nm

Forward Voltage per LED VF2.2 2.6 V IF = 20 mA

Reverse Breakdown Voltage per LED[5] VR615 V I

= 100 µA

Thermal Resistance LED Junction-to-Pin RθJ-PIN 150 °C/W/

LED

Notes:

1. These devices are categorized for luminous intensity. The intensity category is designated by a letter code on the side of the package.

2. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of the

device. Yellow and Green devices are categorized for dominant wavelength with the color bin designated by a number code on the side

of the package.

3. This is an HER/Yellow bicolor light bar. HER electrical/optical characteristics are shown in the HER table. Yellow electrical/optical

characteristics are shown in the Yellow table.

4. This is an HER/Green bicolor light bar. HER electrical/optical characteristics are shown in the HER table. Green electrical/optical

characteristics are shown in the Green table.

5. Does not apply to HLMP-2950 or HLMP-2965.

Figure 1. Maximum Allowable Peak Current vs. Pulse Duration.

Figure 4. Forward Current vs. Forward Voltage. Figure 5. Relative Luminous Intensity vs. DC Forward

Current.

AlGaAs Red

Figure 2. Maximum Allowed DC Current per LED vs.

Ambient Temperature, TJMAX = 110 °C. Figure 3. Relative Efficiency (Luminous Intensity per Unit

Current) vs. Peak LED Current.

For a detailed explanation on the use of data sheet information and recommended soldering procedures,

see Application Notes 1005, 1027, and 1031.

HER, Yellow, Green

Figure 9. Forward Current vs. Forward Voltage

Characteristics. Figure 10. Relative Luminous Intensity vs. DC Forward

Current.

Figure 6. Maximum Allowed Peak Current vs. Pulse

Duration.

Figure 7. Maximum Allowable DC Current per LED vs.

Ambient Temperature, TJ MAX = 100°C. Figure 8. Relative Efficiency (Luminous Intensity per Unit

Current) vs. Peak LED Current.

IAVG

Iv TIME AVG = ITEST

where:

ITEST = 3 mA for AlGaAs Red

(HLMP-X000 series)

20 mA for HER,

Yellow and Green

(HLMP-2XXX series)

Example:

For HLMP-2735 series

ηIPEAK = 1.18 at IPEAK = 48 mA

12 mA

Iv TIME AVG = 20 mA

= 25 mcd

[]

Electrical

These light bars are composed of

two, four, or eight light emitting

diodes, with the light from each

LED optically scattered to form

an evenly illuminated light

emitting surface.

The anode and cathode of each

LED is brought out by separate

pins. This universal pinout

arrangement allows the LEDs to

be connected in three possible

configurations: parallel, series, or

series parallel. The typical

forward voltage values can be

scaled from Figures 4 and 9.

These values should be used to

calculate the current limiting

resistor value and typical power

consumption. Expected maximum

VF values for driver circuit design

and maximum power dissipation,

may be calculated using the

following VFMAX models:

AlGaAs Red HLCP-X100 series

VFMAX = 1.8 V + IPeak (20 Ω)

For: IPeak ≤ 20 mA

VFMAX = 2.0 V + IPeak (10 Ω)

For: 20 mA ≤ IPeak ≤ 45 mA

HER (HLMP-2300/2600/2900),

Yellow (HLMP-2400/2700/2900)

and Green (HLMP-2500/2800/

2900) series

VFMAX = 1.6 + IPeak (50 Ω)

For: 5 mA ≤ IPeak ≤ 20 mA

VFMAX = 1.8 + IPeak (40 Ω)

For: IPeak ≥ 20 mA

The maximum power dissipation

can be calculated for any pulsed

or DC drive condition. For DC

operation, the maximum power

dissipation is the product of the

maximum forward voltage and the

maximum forward current. For

pulsed operation, the maximum

power dissipation is the product

of the maximum forward voltage

at the peak forward current times

the maximum average forward

current. Maximum allowable

power dissipation for any given

ambient temperature and thermal

resistance (RθJ-A) can be deter-

mined by using Figure 2 or 7. The

solid line in Figure 2 or 7 (RθJ-A of

600/538 C/W) represents a typical

thermal resistance of a device

socketed in a printed circuit

board. The dashed lines represent

achievable thermal resistances

that can be obtained through

improved thermal design. Once

the maximum allowable power

dissipation is determined, the

maximum pulsed or DC forward

current can be calculated.

Optical

Size of Light Surface Area

Emitting

Area Sq. Metres Sq. Feet

8.89 mm x 8.89 mm 67.74 x 10–6 729.16 x 10–6

8.89 mm x 3.81 mm 33.87 x 10–6 364.58 x 10–6

8.89 mm x 19.05 mm 135.48 x 10–6 1458.32 x 10–6

3.81 mm x 19.05 mm 72.85 x 10–6 781.25 x 10–6

The radiation pattern for these

light bar devices is approximately

Lambertian. The luminous

sterance may be calculated using

one of the two following formulas:

Iv (cd)

Lv (cd/m2) =A (m2)

πIv (cd)

Lv (footlamberts) = A (ft2)

Refresh rates of 1 kHz or faster

provide the most efficient

operation resulting in the maxi-

mum possible time average

luminous intensity.

The time average luminous

intensity may be calculated using

the relative efficiency character-

istic of Figure 3 or 8, ηIPEAK, and

adjusted for operating ambient

temperature. The time average

luminous intensity at TA = 25°C is

calculated as follows:

(ηIPEAK) (Iv Data Sheet)

(1.18) (35 mcd)

The time average luminous

intensity may be adjusted for

operating ambient temperature by

the following exponential

equation:

Iv (TA) = IV (25°C)e[K (T –25°C)]

Color K

AlGaAs Red –0.0095/°C

HER –0.0131/°C

Yellow –0.0112/°C

Green –0.0104/°C

Example:

Iv (80°C) = (25 mcd)e[-0.0112 (80-25)]

= 14 mcd.

Mechanical

These light bar devices may be

operated in ambient temperatures

above +60°C without derating

when installed in a PC board

configuration that provides a

thermal resistance pin to ambient

value less than 280°C/W/LED. See

Figure 2 or 7 to determine the

maximum allowed thermal

resistance for the PC board,

RθPC-A, which will permit

nonderated operation in a given

ambient temperature.

To optimize device optical

performance, specially developed

plastics are used which restrict

the solvents that may be used for

cleaning. It is recommended that

only mixtures of Freon (F113)

and alcohol be used for vapor

cleaning processes, with an

immersion time in the vapors of

less than two (2) minutes

maximum. Some suggested vapor

cleaning solvents are Freon TE,

Genesolv DES, Arklone A or K. A

60°C (140°F) water cleaning

process may also be used, which

includes a neutralizer rinse (3%

ammonia solution or equivalent),

a surfactant rinse (1% detergent

solution or equivalent), a hot

water rinse and a thorough air

dry. Room temperature cleaning

may be accomplished with Freon

T-E35 or T-P35, Ethanol,

Isopropanol or water with a mild

detergent.

For further information on

soldering LEDs please refer to

Application Note 1027.

www.semiconductor.agilent.com

Data subject to change.

Obsoletes 5954-8466, 5954-0925,

5954-0937

5962-7197E (11/99)