VO14642AT, VO14642AABTR
www.vishay.com Vishay Semiconductors
Rev. 1.6, 12-Jun-17 2Document Number: 81646
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability
(1) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP)
ABSOLUTE MAXIMUM RATING CURVE
Fig. 1 - Load Current (AC/DC) vs. Temperature
Note
• The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's thermal
characteristics of optocouplers application note
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
INPUT
LED continous forward current IF50 mA
LED reverse voltage VR5V
LED power dissipation At 25 °C Pdiss 80 mW
OUTPUT
DC or peak AC load voltage VL60 V
Load current (DC only) IL2A
Peak load current (AC/DC) t = 10 ms ILPK 3.6 A
Output power dissipation At 25 °C Pdiss 250 mW
SSR
Total power dissipation Pdiss 330 mW
Ambient temperature range Tamb -55 to +85 °C
Storage temperature range Tstg -55 to +125 °C
Soldering temperature (1) t ≤ 10 s max. Tsld 260 °C
0.0
0.5
1.0
1.5
2.0
2.5
-50 -25 0 25 50 75 100
Load Current/A
Ambient Temperature/°C
DC mode
THERMAL CHARACTERISTICS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Maximum LED junction temperature At 25 °C Tjmax. 125 °C
Maximum output die junction temperature At 25 °C Tjmax. 125 °C
Thermal resistance, junction emitter to board At 25 °C θEB 176 °C/W
Thermal resistance, junction emitter to case At 25 °C θEC 208 °C/W
Thermal resistance, junction detector to board At 25 °C θDB 67 °C/W
Thermal resistance, junction detector to case At 25 °C θDC 134 °C/W
Thermal resistance, junction emitter to junction detector At 25 °C θED 310 °C/W
Thermal resistance, case to ambient At 25 °C θCA 2180 °C/W