A1
REVISIONS
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
OF
SCALE SHEET REV
NAME
SIZE CAGE CODE DRAWING NO
DIMENSIONS: TOLERANCES UNLESS
OTHERWISE SPECIFIED:
DWN
CHK
APVD
MATERIAL FINISH
PRODUCT SPEC
APPLICATION SPEC
WEIGHT
P LTR DATE APVD
DWNDESCRIPTION
LOC DIST
5
67
8 34 2 1
D
B
A
A
B
CC
D
ALL RIGHTS RESERVED.
RELEASED FOR PUBLICATION
CCOPYRIGHT
THIS DRAWING IS UNPUBLISHED.
4805 (3/11)
RESTRICTED TO
THIS DRAWING IS A CONTROLLED DOCUMENT.
TE Connectivity
2007277-2
7
8
9
12
DREVISED PER ECO-10-004036
26FEB2010
CJV MRS
EREVISED PER ECO-11-019224
09JAN2012
TX AC
FREVISED PER ECO-12-021462
10DEC2012
TX AC
F1 REVISED PER ECO-13-014600
11OCT2013
PP SH
Customer Drawing
2007277
M. SCHMITT
6AUG2007
M. SCHMITT
6AUG2007
B. WERTZ
6AUG2007
6:1 1 2 F1
108-2364
114-13120
-
- -
mm
0.1
0.1
0.1
0.05
0.05
-
GP 00
SFP+ 1X1 CAGE ASSEMBLY
W/ HEATSINK, PCI, PRESS-FIT
EXTERNAL EMI SPRING
-
20
- -
20
00779
BY -
( )3
8.95#0.15
PORT OPENING
PORT OPENING
14 0.1
(48.70)
( )14.5
( )11.5
( )1$
( )9.5
HEAT SINK PART
NUMBER
PIN TYPE HEAT SINK 2007277-1
FIN TYPE HEAT SINK
MATERIAL:
CAGE ASSEMBLY - NICKEL-SILVER ALLOY.
EMI SPRINGS - COPPER ALLOY.
HEATSINK - ALUMINUM.
HEATSINK CLIP - STAINLESS STEEL.
FINISH:
HEATSINK - ELECTROLESS NICKEL.
HEATSINK CLIP - PASSIVATE.
EMI SPRINGS - 0.8um MIN TIN OVER 0.8um MIN NICKEL
NON PLATED EDGES PERMISSIBLE.
3. MATES WITH SFP MSA COMPLIANT TRANSCEIVERS.
PADS AND VIAS CHASSIS GROUND.
DATUMS AND BASIC DIMENSIONS ESTABLISHED BY CUSTOMER.
6. MINIMUM PC BOARD THICKNESS:
SINGLE SIDED = 1.50mm
REFERENCE APPLICATION SPEC. 114-13120, HOLE A, FOR
RECOMMENDED DRILL HOLE DIAMETER AND PLATING
THICKNESS.
REFERENCE APPLICATION SPEC. 114-13120, HOLE C, FOR
RECOMMENDED DRILL HOLE DIAMETER AND PLATING
THICKNESS.
DIMENSIONS APPLIES PRIOR TO INSERTION OF SFP MODULE.
10. CAGE ASSEMBLY, HEATSINK CLIP AND HEATSINK SHIPPED
ASSEMBLED.
11. NOTE DELETED
REFERENCE APPLICATION SPEC. 114-13120, HOLE B, FOR
RECOMMENDED DRILL HOLE DIAMETER AND PLATING
THICKNESS.
APPROXIMATE LOCATION
OF DATE CODE LABEL
2007277-1
SCALE 3:1
PIN TYPE HEAT SINK
CAGE ASSEMBLY
HEATSINK CLIP
EMI SPRINGS
2007277-2
SCALE 3:1
FIN TYPE HEAT SINK
CAGE ASSEMBLY
HEATSINK CLIP
EMI SPRINGS
1
2
4
5
1 2
A1
REVISIONS
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
OF
SCALE SHEET REV
NAME
SIZE CAGE CODE DRAWING NO
DIMENSIONS: TOLERANCES UNLESS
OTHERWISE SPECIFIED:
DWN
CHK
APVD
MATERIAL FINISH
PRODUCT SPEC
APPLICATION SPEC
WEIGHT
P LTR DATE APVD
DWNDESCRIPTION
LOC DIST
5
67
8 34 2 1
D
B
A
A
B
CC
D
ALL RIGHTS RESERVED.
RELEASED FOR PUBLICATION
CCOPYRIGHT
THIS DRAWING IS UNPUBLISHED.
4805 (3/11)
RESTRICTED TO
THIS DRAWING IS A CONTROLLED DOCUMENT.
TE Connectivity
34.5
3X 10
5
3X 10
( )
PLATING REQUIRED
0.85
( )
PLATING REQUIRED
1.05
9X (n )
PLATING REQUIRED
1.05
9.6
2X n1.55 0.05 0.9
20X 0.5 0.03
20X 2 0.05
9X ( )
PLATING REQUIRED
0.95
-SEE SHEET 1
-
- -
Customer Drawing
2007277
M. SCHMITT
6AUG2007
M. SCHMITT
6AUG2007
B. WERTZ
6AUG2007
6:1 2 2 F1
108-2364
114-13120
-
- -
mm
0.1
0.1
0.1
0.05
0.05
-
GP 00
SFP+ 1X1 CAGE ASSEMBLY
W/ HEATSINK, PCI, PRESS-FIT
EXTERNAL EMI SPRING
-
20
- -
20
00779
BY -
5.68
8.58
11.08
14.25
16.25
MIN
CUTOUT
16.5
Y.YY
26.8
41.3
42.3
11X 2
11X 2
2.48
4.8
9.6
11.93
2.5
2.5
7.2
3.33
8.13
2.8
2.8
10.53
5
7.13.2
18X 0.8
11.93
10.93
10.4
MIN16.25
15.45
4X R MAX
EACH CUTOUT
0.3 ( )45.4
( )10.8
TOP OF PC BOARD
TO INSIDE OF BEZEL
0.4
BACK OF BEZEL TO
FRONT OF PC BOARD
1.02 0.3
BACK OF BEZEL TO
PC BOARD CUTOUT
3.5 0.3
( )1$
13.5 MAX
Y
A
B
X
RECOMMENDED PCB LAYOUT
SCALE 8:1
CROSS-HATCHED AREA
DENOTES COMPONENT AND
TRACE KEEP-OUT
(EXCEPT CHASSIS GROUND)
THIS AREA DENOTES
COMPONENT KEEP-OUT
(TRACES ALLOWED)
SEE DETAIL A
DETAIL A
SCALE 8:1
PIN #11
PIN #20
PIN #10
PIN #1
CAGE ASSEMBLY MOUNTED ON RECOMMENDED
PC BOARD SHOWN THRU RECOMMENDED BEZEL
SCALE 4:1
RECOMMENDED BEZEL CUTOUT
SCALE 4:1
12
5
5
4
4
4
47
7
4 8
9
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
TE Connectivity:
2007277-1