SSTU32866 1.8 V 25-bit 1:1 or 14-bit 1:2 configurable registered buffer with parity for DDR2 RDIMM applications Rev. 02 -- 11 November 2004 Product data sheet 1. General description The SSTU32866 is a 1.8 V configurable register specifically designed for use on DDR2 memory modules requiring a parity checking function. It is defined in accordance with the JEDEC JESD82-7 standard for the SSTU32864 registered buffer, while adding the parity checking function in a compatible pinout. The JEDEC standard for SSTU32866 is pending publication. The register is configurable (using configuration pins C0 and C1) to two topologies: 25-bit 1:1 or 14-bit 1:2, and in the latter configuration can be designated as Register A or Register B on the DIMM. The SSTU32866 accepts a parity bit from the memory controller on its parity bit (PAR_IN) input, compares it with the data received on the DIMM-independent D-inputs and indicates whether a parity error has occurred on its open-drain QERR pin (active-LOW). The convention is even parity, that is, valid parity is defined as an even number of ones across the DIMM-independent data inputs combined with the parity input bit. The SSTU32866 is packaged in a 96-ball, 6 x 16 grid, 0.8 mm ball pitch LFBGA package (13.5 mm by 5.5 mm). 2. Features Configurable register supporting DDR2 Registered DIMM applications Configurable to 25-bit 1:1 mode or 14-bit 1:2 mode Controlled output impedance drivers enable optimal signal integrity and speed Exceeds JESD82-7 speed performance (1.8 ns max. single-bit switching propagation delay; 2.0 ns max. mass-switching) Supports up to 450 MHz clock frequency of operation Optimized pinout for high-density DDR2 module design Chip-selects minimize power consumption by gating data outputs from changing state Supports SSTL_18 data inputs Checks parity on the DIMM-independent data inputs Partial parity output and input allows cascading of two SSTU32866s for correct parity error processing Differential clock (CK and CK) inputs Supports LVCMOS switching levels on the control and RESET inputs Single 1.8 V supply operation Available in 96-ball, 13.5 x 5.5 mm, 0.8 mm ball pitch LFBGA package SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 3. Applications DDR2 registered DIMMs desiring parity checking functionality 4. Ordering information Table 1: Ordering information Tamb = 0 C to +70 C. Type number Solder process Package Name Description Version SSTU32866EC/G Pb-free (SnAgCu solder LFBGA96 ball compound) plastic low profile fine-pitch ball grid array package; SOT536-1 96 balls; body 13.5 x 5.5 x 1.05 mm SSTU32866EC plastic low profile fine-pitch ball grid array package; SOT536-1 96 balls; body 13.5 x 5.5 x 1.05 mm SnPb solder ball compound LFBGA96 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 2 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 5. Functional diagram RESET CK CK SSTU32866 VREF DCKE DODT DCS 1D C1 QCKEA R QCKEB (1) 1D C1 R QODTA 1D C1 R QCSA 1D C1 R Q2A QODTB (1) QCSB (1) CSR D2 0 1 Q2B (1) 002aaa649 to 10 other channels (D3, D5, D6, D8 to D14) (1) Disabled in 1:1 configuration. Fig 1. Functional diagram of SSTU32866; 1:2 Register A configuration with C0 = 0 and C1 = 1 (positive logic) 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 3 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity RESET CK CK LPS0 (internal node) D2, D3, D5, D6, D8 to D14 VREF 11 CE 11 D2, D3, D5, D6, 11 D8 to D14 D CLK 11 R D2, D3, D5, D6, D8 to D14 11 Q2A, Q3A, Q5A, Q6A, Q8A to Q14A Q2B, Q3B, Q5B, Q6B, Q8B to Q14B PARITY CHECK C1 1 0 D CLK R 1 PPO D CLK R CE 0 D CLK R PAR_IN QERR C0 CLK 2-BIT COUNTER R LPS1 (internal node) 0 D CLK R 1 002aaa650 Fig 2. Parity logic diagram for 1:2 Register A configuration (positive logic); C0 = 0, C1 = 1 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 4 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 6. Pinning information 6.1 Pinning SSTU32866EC/G ball A1 SSTU32866EC index area 1 2 3 4 5 6 A B C D E F G H J K L M N P R T 002aab135 Transparent top view Fig 3. Pin configuration for LFBGA96 1 2 3 4 5 6 A DCKE PPO VREF VDD QCKE d.n.u. B D2 D15 GND GND Q2 Q15 C D3 D16 VDD VDD Q3 Q16 D DODT QERR GND GND QODT d.n.u. E D5 D17 VDD VDD Q5 Q17 F D6 D18 GND GND Q6 Q18 G PAR_IN RESET VDD VDD C1 C0 H CK DCS GND GND QCS d.n.u. J CK CSR VDD VDD n.c. n.c. K D8 D19 GND GND Q8 Q19 L D9 D20 VDD VDD Q9 Q20 M D10 D21 GND GND Q10 Q21 N D11 D22 VDD VDD Q11 Q22 P D12 D23 GND GND Q12 Q23 R D13 D24 VDD VDD Q13 Q24 T D14 D25 VREF VDD Q14 Q25 002aab108 Fig 4. Ball mapping, 1:1 register (C0 = 0, C1 = 0) 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 5 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 1 2 3 4 5 6 A DCKE PPO VREF VDD QCKEA QCKEB B D2 d.n.u. GND GND Q2A Q2B C D3 d.n.u. VDD VDD Q3A Q3B D DODT QERR GND GND QODTA QODTB E D5 n.c. VDD VDD Q5A Q5B F D6 n.c. GND GND Q6A Q6B G PAR_IN RESET VDD VDD C1 C0 H CK DCS GND GND QCSA QCSB J CK CSR VDD VDD n.c. n.c. K D8 d.n.u. GND GND Q8A Q8B L D9 d.n.u. VDD VDD Q9A Q9B M D10 d.n.u. GND GND Q10A Q10B N D11 d.n.u. VDD VDD Q11A Q11B P D12 d.n.u. GND GND Q12A Q12B R D13 d.n.u. VDD VDD Q13A Q13B T D14 d.n.u. VREF VDD Q14A Q14B 002aab109 Fig 5. Ball mapping, 1:2 Register A (C0 = 0, C1 = 1) 1 2 3 4 5 6 A D1 PPO VREF VDD Q1A Q1B B D2 d.n.u. GND GND Q2A Q2B C D3 d.n.u. VDD VDD Q3A Q3B D D4 QERR GND GND Q4A Q4B E D5 d.n.u. VDD VDD Q5A Q5B F D6 d.n.u. GND GND Q6A Q6B G PAR_IN RESET VDD VDD C1 C0 H CK DCS GND GND QCSA QCSB J CK CSR VDD VDD n.c. n.c. K D8 d.n.u. GND GND Q8A Q8B L D9 d.n.u. VDD VDD Q9A Q9B M D10 d.n.u. GND GND Q10A Q10B N DODT d.n.u. VDD VDD QODTA QODTB P D12 d.n.u. GND GND Q12A Q12B R D13 d.n.u. VDD VDD Q13A Q13B T DCKE d.n.u. VREF VDD QCKEA QCKEB 002aab110 Fig 6. Ball mapping, 1:2 Register B (C0 = 1, C1 = 1) 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 6 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 6.2 Pin description Table 2: Pin description Symbol Pin Type Description GND B3, B4, D3, D4, F3, F4, H3, H4, K3, K4, M3, M4, P3, P4 ground input ground VDD A4, C3, C4, E3, E4, G3, G4, J3, J4, L3, L4, N3, N4, R3, R4, T4 1.8 V nominal power supply voltage VREF A3, T3 0.9 V nominal input reference voltage CK H1 Differential input positive master clock input CK J1 Differential input negative master clock input C0 G6 LVCMOS inputs C1 G5 Configuration control inputs; Register A or Register B and 1:1 mode or 1:2 mode select. RESET G2 LVCMOS input Asynchronous reset input. Resets registers and disables VREF data and clock. CSR J2 SSTL_18 input DCS H2 Chip select inputs. Disables D1 to D25 [2] outputs switching when both inputs are HIGH. D1 to D25 [1] SSTL_18 input Data input. Clocked in on the crossing of the rising edge od CK and the falling edge of CK. DODT [1] SSTL_18 input The outputs of this register bit will not be suspended by the DCS and CSR control. DCKE [1] SSTL_18 input The outputs of this register bit will not be suspended by the DCS and CSR control. PAR_IN G1 SSTL_18 input Parity input. Arrives one clock cycle after the corresponding data input. Q1 to Q25, Q2A to Q14A, Q1B to Q14B [1] 1.8 V CMOS outputs Data outputs that are suspended by the DCS and CSR control. [3] PPO A2 1.8 V CMOS output Partial parity out. Indicates odd parity of inputs D1 to D25 [2]. QCS, QCSA, QCSB [1] 1.8 V CMOS output Data output that will not be suspended by the DCS and CSR control. QODT, QODTA, QODTB [1] 1.8 V CMOS output Data output that will not be suspended by the DCS and CSR control. QCKE, QCKEA, QCKEB [1] 1.8 V CMOS output Data output that will not be suspended by the DCS and CSR control. 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 7 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity Table 2: Pin description ...continued Symbol Pin Type Description QERR D2 open-drain output Output error bit. Generated one clock cycle after the corresponding data output n.c. [1] - Not connected. Ball present but no internal connection to the die. d.n.u. [1] - Do not use. Inputs are in standby-equivalent mode and outputs are driven LOW. [1] Depends on configuration. Refer to Figure 4, Figure 5, and Figure 6 for ball number. [2] Data inputs = D2, D3, D5, D6, D8 to D25 when C0 = 0 and C1 = 0. Data inputs = D2, D3, D5, D6, D8 to D14 when C0 = 0 and C1 = 1. Data inputs = D1 to D6, D8 to D10, D12, D13 when C0 = 1 and C1 = 1. [3] Data outputs = Q2, Q3, Q5, Q6, Q8 to Q25 when C0 = 0 and C1 = 0. Data outputs = Q2, Q3, Q5, Q6, Q8 to Q14 when C0 = 0 and C1 = 1. Data outputs = Q1 to Q6, Q8 to Q10, Q12, Q13 when C0 = 1 and C1 = 1. 7. Functional description The SSTU32866 is a 25-bit 1:1 or 14-bit 1:2 configurable registered buffer with parity, designed for 1.7 V to 1.9 V VDD operation. All clock and data inputs are compatible with the JEDEC standard for SSTL_18. The control and reset (RESET) inputs are LVCMOS. All data outputs are 1.8 V CMOS drivers that have been optimized to drive the DDR2 DIMM load, and meet SSTL_18 specifications. The error (QERR) output is 1.8 V open-drain driver. The SSTU32866 operates from a differential clock (CK and CK). Data are registered at the crossing of CK going HIGH, and CK going LOW. The C0 input controls the pinout configuration for the 1:2 pinout from A configuration (when LOW) to B configuration (when HIGH). The C1 input controls the pinout configuration from 25-bit 1:1 (when LOW) to 14-bit 1:2 (when HIGH). The SSTU32866 accepts a parity bit from the memory controller on its parity bit (PAR_IN) input, compares it with the data received on the DIMM-independent D-inputs and indicates whether a parity error has occurred on its open-drain QERR pin (active-LOW). The convention is even parity, i.e., valid parity is defined as an even number of ones across the DIMM-independent data inputs combined with the parity input bit. When used as a single device, the C0 and C1 inputs are tied LOW. In this configuration, parity is checked on the PAR_IN input which arrives one cycle after the input data to which it applies. The partial-parity-out (PPO) and QERR signals are produced three cycles after the corresponding data inputs. When used in pairs, the C0 input of the first register is tied LOW and the C0 input of the second register is tied HIGH. The C1 input of both registers are tied HIGH. Parity, which arrives one cycle after the data input to which it applies, is checked on the PAR_IN input of the first device. The PPO and QERR signals are produced on the second device three clock cycles after the corresponding data inputs. The PPO output of the first register is 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 8 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity cascaded to the PAR_IN of the second register. The QERR output of the first register is left floating and the valid error information is latched on the QERR output of the second register. If an error occurs and the QERR output is driven LOW, it stays latched LOW for two clock cycles or until RESET is driven LOW. The DIMM-dependent signals (DCKE, DCS, DODT, and CSR) are not included in the parity check computation. The device supports low-power standby operation. When RESET is LOW, the differential input receivers are disabled, and undriven (floating) data, clock and reference voltage (VREF) inputs are allowed. In addition, when RESET is LOW all registers are reset, and all outputs are forced LOW. The LVCMOS RESET input must always be held at a valid logic HIGH or LOW level. The device also supports low-power active operation by monitoring both system chip select (DCS and CSR) inputs and will gate the Qn and PPO outputs from changing states when both DCS and CSR inputs are HIGH. If either DCS or CSR input is LOW, the Qn and PPO outputs will function normally. The RESET input has priority over the DCS and CSR control and when driven LOW will force the Qn and PPO outputs LOW, and the QERR output HIGH. If the DCS control functionality is not desired, then the CSR input can be hard-wired to ground, in which case, the set-up time requirement for DCS would be the same as for the other Dn data inputs. To control the low-power mode with DCS only, then the CSR input should be pulled up to VDD through a pull-up resistor. To ensure defined outputs from the register before a stable clock has been supplied, RESET must be held in the LOW state during power-up. In the DDR2 RDIMM application, RESET is specified to be completely asynchronous with respect to CK and CK. Therefore, no timing relationship can be guaranteed between the two. When entering reset, the register will be cleared and the Qn outputs will be driven LOW quickly, relative to the time to disable the differential input receivers. However, when coming out of reset, the register will become active quickly, relative to the time to enable the differential input receivers. As long as the data inputs are LOW, and the clock is stable during the time from the LOW-to-HIGH transition of RESET until the input receivers are fully enabled, the design of the SSTU32866 must ensure that the outputs will remain LOW, thus ensuring no glitches on the output. 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 9 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 7.1 Function table Table 3: Function table (each flip-flop) L = LOW voltage level; H = HIGH voltage level; X = don't care; = LOW-to-HIGH transition; = HIGH-to-LOW transition Outputs [1] Inputs RESET DCS CSR CK CK Dn, DODTn, DCKEn Qn QCS QODT, QCKE H L L L L L L H L L H H L H H L L L or H L or H X Q0 Q0 Q0 H L H L L L L H L H H H L H H L H L or H L or H X Q0 Q0 Q0 H H L L L H L H H L H H H H H H L L or H L or H X Q0 Q0 Q0 H H H L Q0 H L H H H H Q0 H H [1] H H H L or H L or H X Q0 Q0 Q0 L X or floating X or floating X or floating X or floating X or floating L L L Q0 is the previous state of the associated output. Table 4: Parity and standby function table L = LOW voltage level; H = HIGH voltage level; X = don't care; = LOW-to-HIGH transition; = HIGH-to-LOW transition Outputs [1] Inputs RESET DCS CSR CK CK of inputs = H (D1 to D25) PAR_IN [2] PPO [3] QERR H L X even L L H H L X odd L H L H L X even H H L H L X odd H L H H H L even L L H H H L odd L H L H H L even H H L H H L odd H L H H H H X X PPO0 QERR0 H X X L or H L or H X X PPO0 QERR0 X or floating X or floating L H L X or floating X or floating X or floating X or floating [1] PPO0 is the previous state of output PPO; QERR0 is the previous state of output QERR. [2] Data inputs = D2, D3, D5, D6, D8 to D25 when C0 = 0 and C1 = 0. Data inputs = D2, D3, D5, D6, D8 to D14 when C0 = 0 and C1 = 1. Data inputs = D1 to D6, D8 to D10, D12, D13 when C0 = 1 and C1 = 1. [3] PAR_IN arrives one clock cycle (C0 = 0), or two clock cycles (C0 = 1), after the data to which it applies. [4] This condition assumes QERR is HIGH at the crossing of CK going HIGH and CK going LOW. If QERR is LOW, it stays latched LOW for two clock cycles or until RESET is driven LOW. 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 10 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 8. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). [1] Symbol Parameter VDD Conditions Min Max Unit supply voltage -0.5 +2.5 V +2.5 [3] V VI receiver input voltage -0.5 [2] VO driver output voltage -0.5 [2] VDD + 0.5 [3] V IIK input clamp current VI < 0 V or VI > VDD - -50 mA IOK output clamp current VO < 0 V or VO > VDD - 50 mA IO continuous output current 0 V < VO < VDD - 50 mA ICCC continuous current through each VDD or GND pin - 100 mA Tstg storage temperature -65 +150 C Vesd electrostatic discharge voltage Human Body Model (HBM); 1.5 k; 100 pF 2 - kV Machine Model (MM); 0 ; 200 pF 200 - V [1] Stresses beyond those listed under `absolute maximum ratings' may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under `recommended operating conditions' is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. [2] The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. [3] This value is limited to 2.5 V maximum. 9. Recommended operating conditions Table 6: Recommended operating conditions Symbol Parameter VDD Conditions Min Typ Max Unit supply voltage 1.7 - 1.9 V VREF reference voltage 0.49 x VDD 0.50 x VDD 0.51 x VDD V VTT termination voltage VREF - 40 mV VREF VREF + 40 mV V VI input voltage 0 - VDD V VIH(AC) AC HIGH-level input voltage data (Dn), CSR, and PAR_IN inputs VREF + 250 mV - - V VIL(AC) AC LOW-level input voltage data (Dn), CSR, and PAR_IN inputs - - VREF - 250 mV V VIH(DC) DC HIGH-level input voltage data (Dn), CSR, and PAR_IN inputs VREF + 125 mV - - V VIL(DC) DC LOW-level input voltage data (Dn), CSR, and PAR_IN inputs - - VREF - 125 mV V VIH HIGH-level input voltage RESET, Cn [1] 0.65 x VDD - - V - - 0.35 x VDD V 0.675 - 1.125 V VIL LOW-level input voltage RESET, Cn [1] VICR common mode input voltage range CK, CK [2] 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 11 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity Table 6: Recommended operating conditions ...continued Symbol Parameter Conditions VID differential input voltage CK, CK Min Typ Max Unit 600 - - mV IOH HIGH-level output current - - -8 mA IOL LOW-level output current - - 8 mA Tamb operating ambient temperature in free air 0 - +70 C [2] [1] The RESET and Cn inputs of the device must be held at valid levels (not floating) to ensure proper device operation. [2] The differential inputs must not be floating, unless RESET is LOW. 10. Characteristics Table 7: Characteristics At recommended operating conditions (see Table 6), unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VOH HIGH-level output voltage IOH = -6 mA; VDD = 1.7 V 1.2 - - V VOL LOW-level output voltage IOL = 6 mA; VDD = 1.7 V - - 0.5 V II input current all inputs; VI = VDD or GND; VDD = 1.9 V - - 5 A IDD static standby current RESET = GND; IO = 0 mA; VDD = 1.9 V - - 100 A static operating current RESET = VDD; IO = 0 mA; VDD = 1.9 V; VI = VIH(AC) or VIL(AC) - - 40 mA dynamic operating current per MHz, RESET = VDD; clock only VI = VIH(AC) or VIL(AC); CK and CK switching at 50 % duty cycle. IO = 0 mA; VDD = 1.8 V - 16 - A dynamic operating current per MHz, RESET = VDD; per each data input, 1:1 mode VI = VIH(AC) or VIL(AC); CK and CK switching at 50 % duty cycle. One data input switching at half clock frequency, 50 % duty cycle. IO = 0 mA; VDD = 1.8 V - 11 - A dynamic operating current per MHz, RESET = VDD; VI = VIH(AC) or VIL(AC); CK and CK per each data input, 1:2 mode switching at 50 % duty cycle. One data input switching at half clock frequency, 50 % duty cycle. IO = 0 mA; VDD = 1.8 V - 19 - A IDDD Ci input capacitance, data and CSR inputs VI = VREF 250 mV; VDD = 1.8 V 2.5 - 3.5 pF input capacitance, CK and CK inputs VICR = 0.9 V; Vi(p-p) = 600 mV; VDD = 1.8 V 2 - 3 pF input capacitance, RESET input VI = VDD or GND; VDD = 1.8 V 3 - 4 pF 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 12 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity Table 8: Timing requirements At recommended operating conditions (see Table 6), unless otherwise specified. See Figure 2. Symbol Parameter Conditions Min Typ Max Unit fclock clock frequency - - 450 MHz tW pulse duration, CK, CK HIGH or LOW 1 - - ns tACT differential inputs active time [1] [2] - - 10 ns tINACT differential inputs inactive time [1] [3] tsu set-up time hold time th - - 15 ns DCS before CK, CK, CSR HIGH; CSR before CK, CK, DCS HIGH 0.7 - - ns DCS before CK, CK, CSR LOW 0.5 - - ns DODT, DCKE and data (Dn) before CK, CK 0.5 - - ns PAR_IN before CK, CK 0.5 - - ns DCS, DODT, DCKE and data (Dn) after CK, CK 0.5 - - ns PAR_IN after CK, CK 0.5 - - ns [1] This parameter is not necessarily production tested. [2] VREF must be held at a valid input voltage level and data inputs must be held LOW for a minimum time of tACT(max) after RESET is taken HIGH. [3] VREF, data and clock inputs must be held at valid levels (not floating) a minimum time of tINACT(max) after RESET is taken LOW. Table 9: Switching characteristics At recommended operating conditions (see Table 6), unless otherwise specified. See Section 11.1. Symbol Parameter fMAX maximum input clock frequency Conditions [1] Min Typ Max Unit 450 - - MHz 1.41 - 1.8 ns tPDM propagation delay, single bit switching from CK and CK to Qn tPD propagation delay from CK and CK to PPO 0.5 - 1.8 ns tLH LOW-to-HIGH propagation delay from CK and CK to QERR 1.2 - 3 ns tHL HIGH-to-LOW propagation delay from CK and CK to QERR 1 - 2.4 ns - - 2.0 ns tPDMSS propagation delay, simultaneous switching tPHL HIGH-to-LOW propagation delay from CK and CK to Qn LOW-to-HIGH propagation delay tPLH [1] Includes 350 ps of test-load transmission line delay. [2] This parameter is not necessarily production tested. [1] [2] from RESET to Qn - - 3 ns from RESET to PPO - - 3 ns from RESET to QERR - - 3 ns Table 10: Data output edge rates At recommended operating conditions (see Table 6), unless otherwise specified. See Section 11.2. Symbol Parameter Conditions Min Typ Max Unit dV/dt_r rising edge slew rate from 20 % to 80 % 1 - 4 V/ns dV/dt_f falling edge slew rate from 80 % to 20 % 1 - 4 V/ns dV/dt_ absolute difference between dV/dt_r from 20 % or 80 % and dV/dt_f to 80 % or 20 % - - 1 V/ns 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 13 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 10.1 Timing diagrams RESET DCS CSR m m+1 m+2 m+3 m+4 CK CK tsu th D1 to D25 tPD CK to Q Q1 to Q25 tsu th PAR_IN tPD CK to PPO PPO tPD tPD CK to QERR CK to QERR QERR 002aaa655 Fig 7. Timing diagram for SSTU32866 used as a single device; C0 = 0, C1 = 0 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 14 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity RESET DCS CSR m m+1 m+2 m+3 m+4 CK CK tsu th D1 to D14 tPD CK to Q Q1 to Q14 tsu th PAR_IN tPD CK to PPO PPO tPD tPD CK to QERR CK to QERR QERR (not used) 002aaa656 Fig 8. Timing diagram for the first SSTU32866 (1:2 Register A configuration) device used in pair; C0 = 0, C1 = 1 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 15 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity RESET DCS CSR m m+1 m+2 m+3 m+4 CK CK tsu th D1 to D14 tPD CK to Q Q1 to Q14 tsu th PAR_IN(1) tPD CK to PPO PPO (not used) tPD tPD CK to QERR CK to QERR QERR 002aaa657 (1) PAR_IN is driven from PPO of the first SSTU32866 device. Fig 9. Timing diagram for the second SSTU32866 (1:2 Register B configuration) device used in pair; C0 = 1, C1 = 1 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 16 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 11. Test information 11.1 Parameter measurement information for data output load circuit VDD = 1.8 V 0.1 V. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Z0 = 50 ; input slew rate = 1 V/ns 20 %, unless otherwise specified. The outputs are measured one at a time with one transition per measurement. VDD DUT TL = 50 RL = 1000 TL = 350 ps, 50 CK CK CK inputs OUT CL = 30 pF(1) RL = 1000 test point RL = 100 002aaa371 test point (1) CL includes probe and jig capacitance. Fig 10. Load circuit, data output measurements LVCMOS VDD RESET VDD/2 VDD/2 0V tINACT tACT 90 % IDD(1) 10 % 002aaa372 (1) IDD tested with clock and data inputs held at VDD or GND, and IO = 0 mA. Fig 11. Voltage and current waveforms; inputs active and inactive times tW VIH input VICR VICR VID VIL 002aaa373 VID = 600 mV VIH = VREF + 250 mV (AC voltage levels) for differential inputs. VIH = VDD for LVCMOS inputs. VIL = VREF - 250 mV (AC voltage levels) for differential inputs. VIL = GND for LVCMOS inputs. Fig 12. Voltage waveforms; pulse duration 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 17 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity CK VICR VID CK tsu th VIH input VREF VREF VIL 002aaa374 VID = 600 mV VREF = VDD/2 VIH = VREF + 250 mV (AC voltage levels) for differential inputs. VIH = VDD for LVCMOS inputs. VIL = VREF - 250 mV (AC voltage levels) for differential inputs. VIL = GND for LVCMOS inputs. Fig 13. Voltage waveforms; set-up and hold times CK VICR VICR tPLH tPHL Vi(p-p) CK VOH VTT output 002aaa375 VOL tPLH and tPHL are the same as tPD. Fig 14. Voltage waveforms; propagation delay times (clock to output) LVCMOS VIH RESET VDD/2 VIL tPHL VOH output VTT 002aaa376 VOL tPLH and tPHL are the same as tPD. VIH = VREF + 250 mV (AC voltage levels) for differential inputs. VIH = VDD for LVCMOS inputs. VIL = VREF - 250 mV (AC voltage levels) for differential inputs. VIL = GND for LVCMOS inputs. Fig 15. Voltage waveforms; propagation delay times (reset to output) 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 18 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 11.2 Data output slew rate measurement information VDD = 1.8 V 0.1 V. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Z0 = 50 ; input slew rate = 1 V/ns 20 %, unless otherwise specified. VDD DUT RL = 50 OUT test point CL = 10 pF(1) 002aaa377 (1) CL includes probe and jig capacitance. Fig 16. Load circuit, HIGH-to-LOW slew measurement output VOH 80 % dv_f 20 % dt_f 002aaa378 VOL Fig 17. Voltage waveforms, HIGH-to-LOW slew rate measurement DUT OUT test point CL = 10 pF(1) RL = 50 002aaa379 (1) CL includes probe and jig capacitance. Fig 18. Load circuit, LOW-to-HIGH slew measurement dt_r VOH 80 % dv_r 20 % output 002aaa380 VOL Fig 19. Voltage waveforms, LOW-to-HIGH slew rate measurement 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 19 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 11.3 Error output load circuit and voltage measurement information VDD = 1.8 V 0.1 V. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Z0 = 50 ; input slew rate = 1 V/ns 20 %, unless otherwise specified. VDD DUT RL = 1 k OUT test point CL = 10 pF(1) 002aaa500 (1) CL includes probe and jig capacitance. Fig 20. Load circuit, error output measurements LVCMOS RESET VCC VCC/2 0V tPLH VOH 0.15 V output waveform 2 002aaa501 0V Fig 21. Voltage waveforms, open-drain output LOW-to-HIGH transition time with respect to RESET input. timing inputs VICR Vi(p-p) VICR tHL VCC output waveform 1 VCC/2 002aaa502 VOL Fig 22. Voltage waveforms, open-drain output HIGH-to-LOW transition time with respect to clock inputs 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 20 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity timing inputs VICR Vi(p-p) VICR tLH VOH output waveform 2 0.15 V 002aaa503 0V Fig 23. Voltage waveforms, open-drain output LOW-to-HIGH transition time with respect to clock inputs 11.4 Partial Parity Out load circuit and voltage measurement information VDD = 1.8 V 0.1 V. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Z0 = 50 ; input slew rate = 1 V/ns 20 %, unless otherwise specified. DUT OUT test point CL = 5 pF(1) RL = 1 k 002aaa654 (1) CL includes probe and jig capacitance. Fig 24. Partial Parity Out load circuit CK VICR VICR tPLH tPHL Vi(p-p) CK VOH output VTT 002aaa375 VOL VTT = VDD/2 tPLH and tPHL are the same as tPD. Vi(p-p) = 600 mV Fig 25. Partial Parity Out voltage waveforms; propagation delay times with respect to clock inputs 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 21 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity LVCMOS VIH RESET VDD/2 VIL tPHL VOH output VTT 002aaa376 VOL VTT = VDD/2 tPLH and tPHL are the same as tPD. VIH = VREF + 250 mV (AC voltage levels) for differential inputs. VIH = VDD for LVCMOS inputs. VIL = VREF - 250 mV (AC voltage levels) for differential inputs. VIL = VDD for LVCMOS inputs. Fig 26. Partial Parity Out voltage waveforms; propagation delay times with respect to RESET input 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 22 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 12. Package outline LFBGA96: plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm SOT536-1 A B D ball A1 index area A A2 E A1 detail X e1 C 1/2 e v M C A B e T R P N M L K J H G F E D C B A ball A1 index area y1 C y w M C b e e2 1/2 e 1 2 3 4 5 6 X 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b D E e e1 e2 v w y y1 mm 1.5 0.41 0.31 1.2 0.9 0.51 0.41 5.6 5.4 13.6 13.4 0.8 4 12 0.15 0.1 0.1 0.2 OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 00-03-04 03-02-05 SOT536-1 Fig 27. Package outline SOT536-1 (LFBGA96) 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 23 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 24 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C. 13.5 Package related soldering information Table 11: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Wave Reflow [2] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [4] suitable PLCC [5], SO, SOJ suitable suitable not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not recommended [7] suitable CWQCCN..L [8], PMFP [9], WQCCN..L [8] not suitable LQFP, QFP, TQFP [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 9397 750 14181 Product data sheet not suitable (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 25 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. 14. Abbreviations Table 12: Abbreviations Acronym Description CMOS Complementary Metal Oxide Silicon DDR Double Data Rate DIMM Dual In-line Memory Module JEDEC Joint Electron Device Engineering Council LFBGA Low profile Fine-pitch Ball Grid Array LVCMOS Low Voltage Complementary Metal Oxide Silicon PPO Partial Parity Out PRR Pulse Repetition Rate RDIMM Registered Dual In-line Memory Module SSTL Stub Series Terminated Logic 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 26 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 15. Revision history Table 13: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes SSTU32866_2 20041111 Product data sheet - 9397 750 14181 SSTU32866-01 Modifications: * The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. * * * Data sheet status upgraded to `Product data sheet'. (Old) Figure 1 and Figure 2 (logic diagrams) moved to Section 5 "Functional diagram" Section 6 "Pinning information" - changed `NC' to `n.c.' and `DNU' to `d.n.u.' - added Figure 3 "Pin configuration for LFBGA96" - added Figure 4, Figure 5, and Figure 6 (replacing old Tables 2, 3 and 4 "Ball mapping") - Table 2 "Pin description": added (new) Table note [1] and its references at affected pins.; added pin number column. * * Table 3 "Function table (each flip-flop)": added Table note [1] and its reference at `Outputs'. Table 4 "Parity and standby function table": - added (new) Table note [1] and its reference at `Outputs'. - Table note [4]: changed `This transition assumes ...' to `This condition assumes ...'. * Table 5 "Limiting values": - symbol Vi changed to VI; Symbol Vo changed to VO. - symbols ESDHBM and ESDMM replaced with Vesd (added model types under "Conditions") * Table 6 "Recommended operating conditions": - changed column heading from `Nom' to `Typ' - changed VIH (for Data, CSR, and PAR_IN inputs) to VIH(AC) and VIH(DC); condition changed to `data inputs (Dn) ...' - changed VIL (for Data, CSR, and PAR_IN inputs) to VIL(AC) and VIL(DC); condition changed to `data inputs (Dn) - table note split into 2 notes; references added. * merged sections "Static characteristics" and "Dynamic characteristics" into Section 10 "Characteristics" * Table 7 "Characteristics": changed IDDD Parameter from "dynamic operating current ..." to "dynamic operating current per MHz ..."; change Unit from "A/MHz" to "A". * Table 8 "Timing requirements": - changed symbol fCLOCK to fclock - changed symbol tSU to tsu - changed symbol tH to th SSTU32866-01 * * Figure 7 modified. * added Section 14. Section 11.1 "Parameter measurement information for data output load circuit": titles for Figure 14 and Figure 15 modified. 20040709 Objective data - 9397 750 14181 Product data sheet 9397 750 12145 - (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 27 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 16. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. Definitions 18. Disclaimers Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 19. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com 9397 750 14181 Product data sheet (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 02 -- 11 November 2004 28 of 29 SSTU32866 Philips Semiconductors 1.8 V DDR2 configurable registered buffer with parity 20. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 8 9 10 10.1 11 11.1 11.2 11.3 11.4 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 17 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 Functional description . . . . . . . . . . . . . . . . . . . 8 Function table . . . . . . . . . . . . . . . . . . . . . . . . . 10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 Recommended operating conditions. . . . . . . 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 14 Test information . . . . . . . . . . . . . . . . . . . . . . . . 17 Parameter measurement information for data output load circuit . . . . . . . . . . . . . . . . . . 17 Data output slew rate measurement information . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Error output load circuit and voltage measurement information . . . . . . . . . . . . . . . . 20 Partial Parity Out load circuit and voltage measurement information . . . . . . . . . . . . . . . . 21 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 24 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 25 Package related soldering information . . . . . . 25 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 28 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Contact information . . . . . . . . . . . . . . . . . . . . 28 (c) Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 11 November 2004 Document number: 9397 750 14181 Published in The Netherlands