www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED,INCLUDING THE IMPLIED
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replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
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MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE,DIRECT,
INCIDENTAL, OR CONSEQUENTIAL,INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GP_2000S40_12.08
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenber g 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15,8/F W ah Wai Industrial Centre
No.38-40,Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
Gap Pad
®
2000S40
Highly Confor mable ,Thermally Conductive, Reinforced “S-Class” Gap Filling Material
Gap Pad ®: U.S.Patent 5,679,457 and others
Features and Benefits
• Thermal conductivity: 2.0 W/m-K
• Low “S -Class” ther mal resistance at very
low pressures
• Highly conformable, low hardness
• Designed for low-stress applications
• Fiberglass reinforced for puncture,shear
and tear resistance
Gap Pad 2000S40 is recommended for low-
stress applications that require a mid to high
ther mally conductive interface material.The
highly conformable nature of the material
allows the pad to fill in air voids and air gaps
between PC boards and heat sinks or metal
chassis with stepped topogr aphy, rough
surfaces and high stack-up tolerances.
Gap Pad 2000S40 is offered with inherent
natur al tack on both sides of the mater ial
allowing for stick-in-place character istics during
application assembly.The mater ial is supplied
with protective liner s on both sides.The top
side has reduced tack for ease of handling.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Typical Applications Include:
• Power electronics DC/DC;1/4, 1/2, full bricks, etc .
• Mass storage devices
• Gr aphics card/processor/ASIC
• Wireline/wireless communications hardware
• Automotive engine/transmission controls
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number Standard Options
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
GP2000S40 = Gap Pad 2000S40 Material
GP2000S40 0.020 02 0816 NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125"
02 = Natural tack, both sides
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
––––
TYPICAL PROPERTIES OF GAP PAD 2000S40
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Gray Gray Visual
Reinforcement Carr ier Fiberglass Fiberglass —
Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374
Inherent Surface Tack (1- or 2-sided) 2 2 —
Density (g/cc) 2.9 2.9 ASTM D792
Heat Capacity (J/g-K) 0.6 0.6 ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1) 30 30 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 45 310 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 —
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >5000 >5000 ASTM D149
Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257
Flame Rating V-O V-O U.L. 94
THERMAL
Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470
1) Thirty second delay value Shore 00 hardness scale .
2) Young's Modulus, calculated using 0.01 in/min. step r ate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
0.20 0.50 1.501.00 2.00 2.50
125
100
75
50
25
0
Thickness vs. Thermal Resistance
Gap Pad 2000S40
Thermal Resistance (C-in2/W)
Resultant Thickness (mils)
